<h3 style='margin:5px 0 20px'>Text from the patent</h3> [0001]Embodiments of the present disclosure relate toflexible substrate, and more particularly to a flexible substrate and a method thereof. <br /> <br /> [0002]Flexible substrate is a type of substrate on which electronic circuit assemblies are mounted giving rise to a technology of flexible electronics which is also known as flex circuits. One form of flexible electronic assemblies is manufactured using identical components which are used on a rigid printed circuit boards, allowing the printed circuit boards to flex while in use. Another form of flexible electronics involves various etching techniques to scale down a traditional substrate material to gain flexibility. Further, the flexible substrate may be mounted or fabricated with one or more sensors such as a contact sensor or a proximity sensor which may be used in various applications such as a door to monitor an operation or a mat to detect the range of contact of a user with the mat. <br /> <br /> [0003]In one approach, the flexible substrate which is used on a object is made up of a flexible plastic substrate such as a polyimide, polyether ether ketone (PEEK)or conductive polyester to make the substrate layer flexible. Further, the object consists of pressure sensors integrated within the object, and configured to detect the pressure exerted by the user on the object. However in such system the amount of pressure applied by the user on the object cannot determine whether theapplied pressure is in right contact with the object or not. Further, since the flexible substrate is made up of a single layer, the chances of having short circuit between components in the system is high, which in turn reduces the efficiency of the system. Further, the leakage current in the system increases due to a lack of insulation between the components is high. <br /> <br /> [0004]Hence, there is a need for an improved flexible substrate a method to operate the same.

<h3 style='margin:5px 0 20px'>Text from the patent</h3> [0021]FIG. 1 is a block diagram of a flexible substrate in accordance with an embodiment of the present disclosure.The flexible substrate (10) includes a first flexible layer (20) fabricated with at least one conducting path(30), and configured to sustain an electric power within the conducting path(30).As user herein, a substrate is a thin slice of material which forms a foundation upon which one or more electronic devices are deposited. Further, the substrate is usually made up of silicon, silicon dioxide, aluminium oxide, sapphire, germanium, alloys of silicon or alloys of germanium.In one embodiment, the flexible substrate (10) may be made up of polymers. In one specific embodiment, the flexible substrate (10) may be made up of expanded polyethylene (EPE) sheet. <br /> <br /> [0022]In one embodiment, the conducting path (30) may be made up of a conducting material such as a copper, aluminium, silicon or graphite. In such embodiment, the conducting material may be a metal. In one specific embodiment, the flexible substrate (10) may be made up of the conducting material which may be etched out to provide the conducting path(30).In another specific embodiment, the conducting path (30) may be fabricated on top of the first flexible layer (20). In such embodiment, the conducting path (30) may be fabricated or attached to the first flexible layer (20) using an adhesive material.<br /> <br /> [0023]In another embodiment, the conducting path (30) may be provided with the electric power from a battery or a power supply. In such embodiment, the conducting path (30) may withstand the electric power unit the power supply or the battery may be turned off. <br /> <br /> [0024]The flexible substrate (10) also includes a second flexible layer (40) fabricated with one or more sensors (50)connected in a form of a matrix. The second flexible layer (40) is configured to generate a signal upon receiving aninteraction from at least one user.In one embodiment,the one or more sensors (50) may be one or more contact sensors, one or more pressure sensors or one or more weightsensors.As used herein, a matrix is a square or a rectangular array of numbers in mathematics. Further, matrix sensors is a type of a device in which the one or more sensors are connected in the form of the matrix, whereinthe sensor matrix simultaneously measures a parameter for which the one or more sensors are configured at each point of contact between two touching surfaces.Further, contact sensors are a type of sensors which responds to a contact of an object or a user on a sensor contact face. Further, contact sensors detect the object or the user and measure dimensions based on a detected position.<br /> <br /> [0025]Further, the pressure sensors are a type of electronic sensors which are used to measure the pressure applied on an object. Also, weight sensors also known as load sensors are a type of transduces that is used to create an electrical signal, wherein a magnitude of the electrical signal is directly proportional to an applied force. <br /> <br /> [0026]In one embodiment,the second flexible layer (40) may be fabricated with one or more sensors (50) in the form of a matrix through the conducting path (not shown in the FIG. 1) which may be fabricated using the conducting material. In such embodiment, the one or more sensors(50) and the conducting path for a connection between the one or more sensors (50) may be attached to the second flexible layer (40) using an adhesive material.In one embodiment, the second flexible layer (40) may generate a signal when the user interacts with the second flexible layer(40). <br /> <br /> [0027]The flexible substrate (10) further includes a third flexible layer (60) fabricated in-between the first flexible layer (20) and the second flexible layer(40). The third flexible layer (60) is configured to insulate the conducting path (30) of the first flexible layer (20) from a matrix connection of the second flexible layer(40). In one embodiment, the third flexible layer (60) may be an insulating layer. In such embodiment, the third flexible layer (60) may be placed in-between the first flexible layer (20) and the second flexible layer (40) toavoid short circuit between the one or more sensors(50). <br /> <br /> [0028]In oneembodiment, the third flexible layer (60) may include one or more slots(not shown in the FIG. 1)which may be etched out from the third flexible layer(60). Further, the one or more slots may be configured to locate the one or more sensors (50) on the second flexible layer (40) and to provide connectivityto the one or more sensors (50) with the conducting path(30). <br /> <br /> [0029]In one embodiment, when the user interacts with the flexible substrate(10), the one or more sensors (50) may get in contact with the conducting path (30) of the first flexible layer (20) through the one or moreslots of the third flexible layer(60). Further, the conducting path (30) of the first flexible layer (20) which may be supplied by the electric power may in turn supply the electric power to the one or more sensors (50) on the second flexible layer (40) via the conducting path of the secondflexible layer(60). Further, the third flexible layer (60) may insulate the other parts of the second flexible layer (40) from getting into contact with the first flexible layer(20). <br /> <br /> [0030]The flexible substrate (10) further includes at least one support structure (70) operatively coupled to the first flexible layer (20), the second flexible layer (40) and the third flexible layer (60). The at least one support structure (70) is configured to receive the signal generated by the second flexible layer (40). The at least one support structure (70) is also configured to provide a support for the first flexible layer (20), the second flexible layer (40) and the third flexible layer (60). In one embodiment,the at least onesupporting structures (70) may include a processing device which may be configured to process the signal generated by the plurality of sensors (50). The at least onesupporting structure(70) may also include an analog input extension deviceconfigured to receive an analog input. In such embodiment, the signal generated by the plurality of sensors (50) may be an analog signal.In one embodiment, the at least one support structure (70) may be made up of wood or aluminium bars. <br /> <br /> [0031]The at least one supporting structures (70) may further include a wireless communication module which may be configured to transmit the signal processed by the processing device to another device. In such embodiment, the wireless communication module may be a Bluetooth module, a wireless fidelity (Wi-Fi) module, or a Bluetooth low energy module. In one embodiment, the device may be a hand held device such as a mobile phone, a laptop or a tablet. In another embodiment, the device may be any computer device.

<h3 style='margin:5px 0 20px'>Text from the patent</h3> [0032]FIG. 2 is an exemplary embodiment representing a schematic view of a flexible substrate of FIG. 1 in accordance with an embodiment of the present disclosure. The flexible substrate(80)includes a first layer(90), asecond layer (120) and a third layer (160) which is substantially similar to a first flexible layer(20), a second flexible layer (40) and a third flexible layer (60) of FIG. 1.<br /> <br /> [0033]The first layer (90) is attached with a connecting path(110), wherein the connecting path (110) is substantially similar to a conducting path (30) of FIG. 1. The third layer (160) includes a plurality of slots(180). Further, the second layer (120) includes a plurality of sensors (not shown in FIG. 2) connect to each other through the connecting path(140), wherein the plurality of sensors is similar to one or more sensors (50) of FIG. 1. <br /> <br /> [0034]Further, the second layer (120) includes two supporting structures(150), each fixed to each end of the second layer(120), wherein the two supporting structures (150) are similar to at least one support structure (70) of FIG. 1. <br /> <br /> [0035]Further, the material used for the first layer(90), the second layer (120) and the third layer (160) may be an expanded polyethylene (EPE) sheets(100, 170, 130). In one embodiment, the EPE sheets may be of nano thickness with the order of ten power minus nine. Further, one side of the first layer (90) may be attached with the connecting path (110) which may be made up of a conducting material such as a metal. In such embodiment, the metal may be a copper, aluminium, grapheme, silicon, zinc, nickel, iron, gold, silver or platinum.<br /> <br /> [0036]Further, the connecting path (110) may be designed in such a way that the connecting path (110) easily comes in contact with the plurality of sensors in the second layer(120). Further, the connecting layer (110) may be supplied with a continuous power supply which may make the first layer (90) to withstand the continuous power supply. In one embodiment, the continuous powersupply may be supplied from a battery or regulated power supply. <br /> <br /> [0037]Further, the third layer (160) may be an insulating layer which may include the plurality of slots(180). More specifically, the third layer (160) may be free from any type of conducting material to avoid the flow of electric power in the third layer(160). <br /> <br /> [0038]Further, the second layer (120) may be fabricated with the plurality of sensors in the form of a matrix. In one specific embodiment, the plurality of sensors may be a plurality of connecting sensors. In another embodiment, the plurality of sensors may be a plurality of pressure sensors or a plurality of weight sensors. Further, each side of the second layer (120) may be attached with two supporting structures(150), wherein each of the two supporting structures (150) may be placed at each end of the second layer(120). In one embodiment, the second layer (120) may be fabricated with at least one supporting structure on each side of the second layer(120).<br /> <br /> [0039]Further, the first layer(90), the second layer (120) and the third layer (160) may be placed one on top of the other by keeping the third layer (160) in-between the first layer (90) and the second layer(120). Further, a user may come in contact with the flexible substrate (80) and may induce a pressure on one part of the flexible substrate(80). Further, depending on the pressure, the plurality of sensors which may be fabricated at the one part of the flexible substrate(80) where the pressure may be appliedmay come in contact with connecting path (110) of the first layer (90) through the plurality of slots (180) on the third layer(120). <br /> <br /> [0040]Further,the plurality of sensors at the one part of the flexible substrate (80) where the pressure may be applied may generate a signal which may depend on the pressure applied by the user. Further, the signal generated may be passed on to the two supporting structures (150) on the second layer(120). <br /> <br /> [0041]Further, in one embodiment, the two supporting structures (150) may include aprocessing device which may be configured to process the signal generated by the plurality of signals. The two supporting structures (150) may also include an analog input extension deviceconfigured to receive an analog input. In such embodiment, the signal generated by the plurality of sensors may be an analog signal.<br /> <br /> [0042]The two supporting structures (150) may further include a wireless communication module which may be configured to transmit the signal processed by the processing device to another device. In such embodiment, the wireless communication module may be a Bluetooth module, a wireless fidelity (Wi-Fi) module, or a Bluetooth low energy module.In one embodiment, the device may be a hand held device such as a mobile phone, a laptop or a tablet. In another embodiment, the device may be any computer device.

<h3 style='margin:5px 0 20px'>Text from the patent</h3> [0060]FIG. 7 is a process flow for a flexible substrate in accordance with an embodiment of the present disclosure. The method (200) includes fabricating a first flexible layer(200). In one embodiment, the first flexible layer may be fabricated using an expanded polyethylene (EPE) sheet. In such embodiment, the EPE sheet may be fabricated into a thin layer. <br /> <br /> [0061]The method (200) also includes fabricating a conducting path on the first flexible layer(210). In one embodiment, the conducting path may be attached to the first flexible layer. In such embodiment, the conducting path may be attached using an adhesive material. In another embodiment, the first layer may be fabricated using a conducting material and the conducting path may be etched out from the conducting material. In such embodiment, the conducting path may be fabricated using a conducting material such as conducting metal. In one embodiment, the conducting metals may be a copper, aluminium, grapheme, silicon, zinc, nickel, iron, gold, silver or platinum.In yet another embodiment, the conducting path may be fabricated on a back side of the first flexible layer. <br /> <br /> [0062]The method (200) further includes mounting one or more sensors in aform of a matrix and fabricating a second flexible layer(230). In one embodiment, the second layer may be implanted with the one or more sensors to fabricate the second flexible layer. In one embodiment, the second flexible layer may be fabricated using the EPE sheet. In another embodiment, the one or more sensors may be one or more contact sensors, one or more pressure sensors or one or more weight sensors. In yet another embodiment, the one or more sensors may be connected to each other in a form of thematrix through the conducting path. <br /> <br /> [0063]The method (200) further includes fabricating a third flexible layer(240). In one embodiment, the third flexible layer may be fabricated using the EPE sheet. In another embodiment, the third flexible layer may be an insulating layer. In yet another embodiment, the third flexible layer may include a plurality of slots. In such embodiment, the plurality of slots may be etched out during fabrication of the third flexible layer. Further, the plurality of slots may be configured to induce a contact between the conducting layer of the first flexible layer and the plurality of sensors of the second flexible layer. <br /> <br /> [0064]The method (200) further includes mounting a third flexible layer in-between the first flexible layer and the second flexible layer(250). In one embodiment, the third flexible layer may act as an insulating layer which may avoid the excess flow of electric power in the flexible substrate and may also avoid the short circuiting of the one or more sensors with the conducting path. <br /> <br /> [0065]The method (200) further includes mounting the second flexible layer on top of the third flexiblelayer(260). In one embodiment, the third flexible layer may be mounted on top of the back side of the first flexible layer. Further, the second flexible layer may be mounted on another side of the third flexible layer. In such embodiment, a front side ofthe second flexible layer may be mounted on the other side of the third flexible layer. <br /> <br /> [0066]The method (200) further includes fabricating at least one support structure(270). In one embodiment, the at least one support structure may be fabricated on each side of the second flexible layer. In such embodiment, the at least one support structure may provide a support and a strength to the first flexible layer, the second flexible layer and the third flexible layer. <br /> <br /> [0067]In one specific embodiment, the method (200) for the flexible structure may include receiving an interaction from at least one user. In one embodiment, the interaction of the at least one user may be applying a pressure on the flexible substrate or making a contact with the flexible substrate.<br /> <br /> [0068]The method (200) may also include generating a signal upon receiving the interaction from the user. In one embodiment, the signal may be generated by the at least one sensors upon receiving an interaction from the at least one user. In such embodiment, upon receiving the interaction from the at least one user, the at least one sensor may come in contact with the conducting path of the first flexible layer which may complete the circuit in the second flexible layer and may provoke the at least one sensor to generate the signal. In one embodiment, the signal strength may depend on the amount of pressure applied by the at least one user on the flexible substrate or the type of contact made by the at least one user with the flexible substrate. <br /> <br /> [0069]The method (200) may further include transmitting the signal generated to the at least one support structure. In one embodiment, the at least one support structure may include an analog input device which may be configured to receive the signal transmitted by the at least one sensor. In another specific embodiment, the method may further include processing the signal received. In one embodiment, the signal received by the analog input device may be transmitted to a processing device for further processing of the signal. <br /> <br /> [0070]Further, with reference to the above mentioned embodiment, the method (200) may further include transmitting the signal processed to at least one device. In one embodiment, the signal which may be processed by the processing device may be transmitted to the at least one device. In such embodiment the at least one device may be a hand held device such as a laptop, a tablet or a mobile phone or any computer device.

<h3 style='margin:5px 0 20px'>Text from the patent</h3> WE CLAIM:<br /> <br /> 1.A flexible substrate(10)comprising:a first flexible layer (20) fabricated with at least one conducting path(30), and configured to sustain an electric power within the conducting path(30); a second flexible layer (40) fabricated with one or more sensors (50) connected in a form of a matrix, wherein the second flexible layer (40) is configured to generate a signal upon receiving aninteraction from at least one user, wherein the interaction of the user with the flexible substrate comprises at least one of touch, contact and imparting pressure;a third flexible layer (60) fabricated in-between the first flexible layer (20) and the second flexible layer(40), and configured to insulate the conducting path (30) of the first flexible layer (20) from a matrix connection of the second flexible layer(40),wherein the signal is generated up on receiving the interaction from at least one user,wherein the interaction of the at least one user enables the one or more sensors to create acontact with the conducting path (30) of the first flexible layer (20) through one or more slots of the third flexible layer (60);at least one support structure (70) operatively coupled to the first flexible layer(20), the second flexible layer (40) and the third flexible layer(60), wherein the at least one support structure (70) is configured to:receive the signal generated by the second flexible layer(40); andprovide a support for the first flexible layer(20), the second flexible layer(40)and the third flexible layer(60).<br /> <br /> 2.The flexible substrate (10) as claimed in claim 1, whereinthe flexible substrate comprises an expanded polyethylene (EPE) sheet. <br /> <br /> 3.The flexible substrate (10) as claimed in claim 1, whereinat least one conducting path (30) comprises the at least one conducting path (30) fabricated using a conducting material. <br /> <br /> 4.The flexible substrate (10) as claimed in claim 1, whereinthe conducting path(30) is fabricated within the first flexible layer (20) using an adhesive material. <br /> <br /> 5.The flexible substrate (10) as claimed in claim 1, whereinthe one or more sensors comprises (50) one or more contact sensors, one or more pressure sensors or one or more weight sensors. <br /> <br /> 6.The flexible substrate (10) as claimed in claim 1, whereinthe third flexible layer (60) comprises an insulating layer. <br /> <br /> 7.The flexible substrate (10) as claimed in claim 1, whereinthe third flexible layer (60) comprises the one or more slots configured to locate the one or more sensors (50) on the second flexible layer (40) and to provide a connectivity to the one or more sensors (50) with the conducting path(30) of the first flexible layer (20). <br /> <br /> 8.The flexible substrate (10) as claimed in claim 1, whereinthe at least one support structure (70) comprises:a battery configured to provide electric power to theconducting path (30) of thefirst flexible layer(20);a processor operatively coupled to the battery, and configured to process the signal generated;a wireless transmission module operatively coupled to the processor, and configured to transmit the signal processed to a computer device. <br /> <br /> 9.A method (200) forfabrication ofa flexible substrate comprising:fabricating a first flexible layer(210);fabricatinga conducting path on the first flexible layerfor conductingelectric power;(220) fabricating a second flexible layer to the first flexible layer, the second flexible layer and the third flexible layer;(225)mounting one or more sensors on the second flexible layer arranged in a form of a matrix for generating a signal upon receivinganinteraction from at least one user, wherein receiving the interaction from the at least one user comprises receiving at least one of touch, contact and imparting pressure from the at least one user; (230)fabricating a third flexible layercomprising one or more slots for creating a contact with the conducting path of the first flexible layer through one or more slots of the third flexible layerup on receiving the interaction from at least one user;(240) mounting a third flexible layerin-between the first flexible layer and the second flexible layer;(250)mounting the second flexible layer on top of the third flexible layer; and (260)fabricating at least one support structureto the first flexible layer, the second flexible layer and the third flexible layer.(270)